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AMIS-39100: Octal High Side Driver with Protection
Data Sheet
1.0 General Description
The AMIS-39100 is a general purpose IC with eight integrated high side (HS) output drivers. The device is designed to control the power of virtually any type of load in a 12V automotive environment, such as transistor gates, relays, LEDs etc. Each of the output drivers of the AMIS-39100 is able to drive up to 275mA continuously when connected to an inductive load of 300mH. Even higher driver output currents can be obtained as long as the total current of the device is limited. The integrated charge-pump of the AMIS-39100, which uses only one low cost external capacitor, avoids thermal runaways even if the battery voltage is low. The HS drivers withstand short to ground (even when AMIS-39100 has lost its ground connection), short to the battery and has over-current limitation. In case of a potential hazardous situation, the drivers are switched off and the diagnostic state of the HS drivers can be read out via serial peripheral interface (SPI). In case of a short to ground, the output driver is deactivated after a de-bounce time. The AMIS-39100 can be connected to a 3.3V or 5V microcontroller by means of a SPI interface. This SPI interface is used to control each of the output drivers individually (on or off) and to read the status of each individual output driver (read-back of possible error conditions). This allows the detection of error situations for each driver individually. Furthermore, the SPI interface can be used to readback the status of the built-in thermal shutdown protection. The AMIS-39100 has a low-power mode and excellent handling and system ESD characteristics.
2.0 Key Features
* * * * * * * * * * * * Eight HS drivers Up to 830mA continuous current per driver pair (resistive load) Charge pump with one external capacitor Serial peripheral interface (SPI) Short circuit protection Diagnostic features Power-down mode Internal thermal shutdown 3.3V and 5V microcontroller compliant Excellent system ESD Automotive compliant SO28 package with low Rthja
3.0 Typical Applications
* * * * * * Automotive dashboard Automotive load management Actuator control LED driver applications Relays and solenoids Industrial process control
4.0 Ordering Information
Product Name AMIS39100AGA Package PSOP 300-28 (JEDEC MS-013) Temperature Range -40C...105C
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AMIS-39100: Octal High Side Driver with Protection
5.0 Block Diagram
VDDN 27 5 Power on Reset OUT1 VB1
Data Sheet
4
OUT1
Thermal shutdown
OUT2
6 10
OUT2 VB2
DIN DOUT CLK WR
12 13 2 3 11 OUT4 SPI interface OUT3 9 OUT3
Diagnostic
LOGIC Control
OUT4
19
VB3
OUT5 Oscillator
18
OUT5
OUT6 17 Chargepump OUT7
20 24
OUT6 VB4
CAPA1
23
OUT7
Bandgap OUT8 25 OUT8
AMIS-39100
26 1 14 16 7 8 15 21 22 28
PC20070110.4
TEST2 PDB TEST1 TEST
GND3 GND5 GND1 GND4 GND6 GND2
Figure 1: Block Diagram
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AMIS-39100: Octal High Side Driver with Protection
Data Sheet
6.0 Typical Application Diagram
VBAT
5V-reg
CVCC
CVDDN
CVB
CAPA
CCP
VB1..4
10 19 24
VCC
VDDN
27
17
5
DIN 12 DOUT 13
4
OUT1
Lload1 Cout1 Rload1
Microcontroller
CLK 2 WR 3 PDB 26
AMIS-39100
6 9 11 18 20 23 25 87
OUT8
Lload8 Cout8 Rload8
1 14 16
28 22 21 15
GND TEST1..2 GND1..6
PC20070110.2
Figure 2: Typical Application Diagram
6.1 External Components
It is important to properly decouple the power supplies of the chip with external capacitors that have good high frequency properties. The VB1, VB2, VB3, and VB4 pins are shorted on the PCB level. Also GND1, GND2, GND3, GND4, GND5, GND6, TEST, TEST1, and TEST2 are shorted on the PCB level.
Table 1: External Components Component Function CVB Ccharge_pump C
(2) out (2)
Min.
Value
Max.
Tol. [%]
Units
Decoupling capacitor; X7R Charge pump capacitor
(1)
100 0.47 1 22 22 65 300 350 47
20
nF nF nF
EMC capacitor on connector Decoupling capacitors on OUT 1 to 8; 50V Decoupling capacitors; 50V Load resistance Load inductance at maximum current
The capacitor must be placed close to the AMIS-39100 pins on the PCB. Both capacitors are optional and depend on the final application and board layout.
Cout
20 20 10
nF nF mH
CVDD RLoad LLoad
Notes: (1) (2)
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AMIS-39100: Octal High Side Driver with Protection
7.0 Pin Description
Data Sheet
TEST1 CLK WR OUT1 VB1 OUT2 GND1 GND2 OUT3 VB2 OUT4 DIN DOUT TEST2
1 2 3 4 5 6 7 8 9 10 11 12 13 14
28 27 26 25 24 23 22 21 20 19 18 17 16 15
GND6 VDDN PDB OUT8 VB4 OUT7 GND5 GND4 OUT6 VB3 OUT5 CAPA1 TEST GND3
Figure 3: Pin Description of the AMIS-39100
AMIS-39100
PC20070110.1
Table 2: Pin Out Pin Name 1 TEST1 2 CLK 3 WR 4 OUT1 5 VB1 6 OUT2 7 GND1 8 GND2 9 OUT3 10 VB2 11 OUT4 12 DIN 13 DOUT 14 TEST2 15 GND3 16 TEST 17 CAPA1 18 OUT5 19 VB3 20 OUT6 21 GND4 22 GND5 23 OUT7 24 VB4 25 OUT8 26 PDB 27 VDDN 28 GND6
Description Connect to GND Schmitt trigger SPI CLK input Schmitt trigger SPI write enable input HS driver output Battery supply HS driver output Power ground and thermal dissipation path junction-to-PCB Power ground and thermal dissipation path junction-to-PCB HS driver output Battery supply HS driver output SPI input pin (Schmitt trigger or CMOS inverter) Digital three state output for SPI Connect to GND Power ground and thermal dissipation path junction-to-PCB Connect to GND Charge pump capacitor pin HS driver output Battery supply HS driver output Power ground and thermal dissipation path junction-to-PCB Power ground and thermal dissipation path junction-to-PCB HS driver output Battery supply HS driver output Schmitt trigger power-down input Digital supply Power ground and thermal dissipation path junction-to-PCB
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AMIS-39100: Octal High Side Driver with Protection
Data Sheet
8.0 Electrical and Environmental Ratings
8.1 Absolute Maximum Ratings
Stress levels above those listed in this paragraph may cause immediate and permanent device failure. It is not recommended that more than one of these conditions be applied simultaneously.
Table 3: Absolute Maximum Ratings Symbol Description VDDN Power supply voltage DC battery supply on pins VB1 to VB4 load dump, VB Pulse 5b 400ms Iout_ON Iout_OFF I_OUT_VB Vcapa1 Vdig_in VESD VESD Tj Tmr
Notes: (1) (2) (3)
Min. GND - 0.3
Max. 6
Unit V
GND - 0.3 -3000 -350 -700 0 -0.3 -4 -2 -750 -40 -40
35 350 350 3750 VB+16.5 VDDN+0.3 +4 +2 +750 175 105
V mA mA mA V V kV kV V C C
Maximum output current OUTx pins The HS driver is switched on (1) Maximum output current OUTx pins The HS driver is switched off Maximum output current VB1, 2, 3, 4 pins DC voltage on pins capa1 Voltage on digital inputs CLK, PDB, WR, DIN (2) Pins that connect the application (pins VB1..4 and Out1..8) (2) All other pins (3) ESD according charged device model Junction temperature (T<100 hours) Ambient temperature under bias
(1)
The power dissipation of the chip must be limited not to exceed the maximum junction temperature Tj. According to HBM standard MIL-STD-883 method 3015.7 According to norm EOS/ESD-STM5.3.1-1999 robotic mode
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AMIS-39100: Octal High Side Driver with Protection
Data Sheet
8.2 Thermal Characteristics
Table 4: Thermal Characteristics of the Package Symbol Description Rth(vj-a) Thermal resistance from junction to ambient in power-SO28 package
Conditions In free air
Value 145
Unit K/W
Table 5: Thermal Characteristics of the AMIS-39100 on a PCB PCB Design Conductivity Top and Bottom Layer Two layer (35um) Copper planes according to Figure 4 + 25% copper for the remaining areas Two layer (35um) Copper planes according to Figure 4 + 0% copper for the remaining areas Four layer JEDEC: 25% copper coverage EIA/JESD51-7 One layer JEDEC: 25% copper coverage EIA/JESD51-3
Note: (1) These values are informative only. Rthja = Thermal resistance from junction to ambient
Rthja 24 53 25
(1)
Unit K/W K/W K/W
46
K/W
Top PCB view 5 mm 5 mm 5 mm
Bottom PCB view
114.3
5 mm GND copper Ground plane GND copper 25 % filled by GND copper
114.3
76.2
76.2
Figure 4: Layout Recommendation for Thermal Characteristics
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AMIS-39100: Octal High Side Driver with Protection
Data Sheet
8.3 Electrical Parameters
Operation outside the operating ranges for extended periods may affect device reliability. Total cumulative dwell time above the maximum operating rating for the power supply or temperature must be less than 100 hours. The parameters below are independent from load type (see Section 8.4).
8.3.1. Operating Ranges
Table 6: Operating Ranges Symbol VDDN Vdig_in (1) VB Tamb
Notes: (1)
Description Digital power supply voltage Voltage on digital inputs CLK, PDB, WR, DIN DC battery supply on Pins VB1 to VB4 Ambient temperature
Min. 3.1 -0.3 3.5 -40
Max. 5.5 VDDN 16 105
Unit V V V C
The power dissipation of the chip must be limited not to exceed maximum junction temperature Tj of 130C.
8.3.2. Electrical Characteristics
Table 7: Electrical Characteristics Symbol Description (1) I_VB_norm Consumption on VB without load currents In normal mode of operation PDB = high (1)(2) I_PDB_3.3 Sum of VB and VDDN consumption in power down mode of operation PDB = low, VDDN 3.3V, VB = 12V, 23C ambient CLK and WR are at VDDN voltage (1)(2) I_PDB_5 Sum of VB and VDDN consumption in power down mode of operation PDB = low, VDDN 5V, VB = 24V, 23C ambient CLK and WR are at VDDN voltage I_PDB_MAX_VB VB consumption in power down mode of operation PDB = low, VB = 16V (1) I_VDDN_norm Consumption on VDDN In normal mode of operation PDB = high CLK is 500kHz, VDDN = 5.5V, VB = 16V R_on_1..8 On resistance of the output drivers 1 through 8 Vb= 16V (normal battery conditions and Tamb = 25C) Vb = 4.6V (worst case battery condition and Tamb = 25C) (1) I_OUT_lim_x Internal over-current limitation of HS driver outputs T_shortGND_HSdoff The time from short of HS driver OUTx pin to GND and the driver de-activation; driver is Off. Detection works from VB minimum of 7V VDDN minimum is 3V (1) TSD_H High TSD threshold for junction temperature (temperature rising) TSD_HYST TSD hysteresis for junction temperature
Notes: (1) (2) The power dissipation of the chip must be limited not to exceed maximum junction temperature Tj. The cumulative operation time mentioned above may cause permanent device failure.
Min.
Max. 3.5
Unit mA
25 40 10 1.6
A A A mA
0.65 5,4
1 3 2
A s
130 9
170 18
C C
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AMIS-39100: Octal High Side Driver with Protection
Data Sheet
8.4 Load Specific Parameters
HS driver parameters for specific loads are specified in following categories: A. Parameters for inductive loads up to 350mH and Tambient up to 105C B. Parameters for inductive loads up to 300mH and Tambient up to 105C C. Parameters for resistive loads and Tambient up to 85C
Table 8: Load Specific Characteristics A. Inductive Load up to 350mH and Tambient up to 105C Symbol Description I_OUT_ON_max. Maximum output per HS driver, all eight drivers might be active simultaneously B. Inductive Load up to 300mH and Tambient up to 105C I_OUT_ON_max. Maximum output per HS driver, all eight drivers might be active simultaneously C. Resistive Load and Tambient up to 85C I_OUT_ON_max. Maximum output per HS driver, all eight drivers might be active simultaneously Maximum output per one HS driver, only one can be active Maximum output per HS driver, only two HS drivers from a different pair can be active simultaneously Maximum output per one HS driver pair
Min.
Max. 240
Unit mA
275 350 650 500 830
mA mA mA mA mA
Note: The parameters above are not tested in production but are guaranteed by design.The overall current capability limitations need to be respected at all times.
The maximum current specified in Table 8 cannot always be obtained. The practically obtainable maximum drive current heavily depends on the thermal design of the application PCB (see Section 8.2). The available power in the package is: (TSD_H - T_ambient) / Rthja With TSD_H = 130C and Rthja according to Table 5.
8.5 Charge Pump
The HS drivers use floating NDMOS transistors as power devices. To provide the gate voltages for the NDMOS of the HS drivers, a charge pump is integrated. The storage capacitor is an external one. The charge pump oscillator has typical frequency of 4MHz.
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AMIS-39100: Octal High Side Driver with Protection
Data Sheet
8.6 Diagnostics 8.6.1. Short-Circuit Diagnostics
The diagnostic circuit in the AMIS-39100 monitors the actual output status at the pins of the device and stores the result in the diagnostic register, which is then latched in the output register at the rising edge of the WR-pin. Each driver has its corresponding diagnostic bit DIAG_x. By comparing the actual output status (DIAG_x) with the requested driver status (CMD_x) you can diagnose the correct operation of the application according to Table 9.
8.6.2. Thermal Shutdown (TSD) Diagnostic
In case of TSD activation, all bits DIAG 1 to DIAG 8 in the SPI output register are set into the fault state and all drivers will be switched off (see Table 9). The TSD error condition is active until it is reset by the next correct communication on SPI interface (i.e. number of clock pulses during WR=0 is divisible by 8), provided that the device has cooled down under the TSD trip point.
Table 9: OUT Diagnostics Requested driver status On On Off Off
Note: (1) (2) The correct diagnostic information is available after T_diagnostic_OFF time. All 8 diagnostic bits DIAG_x must be in the fault condition to conclude a TSD diagnostic.
CMD_x
Actual output status
DIAG_x
Diagnosis
1 1 0 0
High Low High Low
1 0 1 0
Normal state (2) Short to ground or TSD (1) (2) Short to VB or missing load or TSD (1) Normal state
8.6.3. Ground Loss
Due to its design, the AMIS-39100 is protected for withstanding module ground loss and driver output shorted to ground at the same time.
8.6.4. Power Loss
Table 10: Power Loss VDDN VB 0 0 0 1 1 1 0 1
Possible Case System stopped Start case or sleeping mode with missing VDDN Action Nothing Eight switches in the off-state Power down consumption on VB Eight switches in the off-state Normal consumption on VDDN Nominal functionality
Missing VB supply VDDN normally present System functional
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AMIS-39100: Octal High Side Driver with Protection
Data Sheet
8.7 SPI Interface
The serial peripheral interface (SPI) is used to allow an external microcontroller (MCU) to communicate with the device. The AMIS39100 acts always as a slave and it can't initiate any transmission.
8.7.1. SPI Transfer Format and Pin Signals
The SPI block diagram and timing characteristics are shown in Figure 6 and Figure 7. During an SPI transfer, data is simultaneously sent to and received from the device. A serial clock line (CLK) synchronizes shifting and sampling of the information on the two serial data lines (DIN and DOUT). DOUT signal is the output from the AMIS-39100 to the external MCU and DIN signal is the input from the MCU to the AMIS-39100. The WR-pin selects the AMIS-39100 for communication and can also be used as a chip select (CS) in a multiple-slave system. The WR-pin is active low. If AMIS-39100 is not selected, DOUT is in high impedance state and it does not interfere with SPI bus activities. Since AMIS-39100 always shifts data out on the rising edge and samples the input data also on the rising edge of the CLK signal, the MCU SPI port must be configured to match this operation. SPI clock idles high between the transferred bytes. The diagram in Figure 7 represents the SPI timing diagram for 8-bit communication. Communication starts with a falling edge on the WR-pin that latches the status of the diagnostic register into the SPI output register. Subsequently, the CMD_x bits - representing the newly requested driver status - are shifted into the input register and simultaneously, the DIAG_x bits - representing the actual output status - are shifted out. The bits are shifted with x=1 first and ending with x=8. At the rising edge of the WR-pin, the data in the input register is latched into the command register and all drivers are simultaneously switching to the newly requested status. SPI communication is ended. In case the SPI master does only support 16-bit communication, then the master must first send 8 clock pulses with dummy DIN data and ignoring the DOUT data. For the next 8 clock pulses the above description can be applied. The required timing for serial to peripheral interface is shown in Table 11.
Table 11: Digital Characteristics Symbol Description T_CLK Maximum applied clock frequency on CLK input T_DATA_ready Time between falling edge on WR and first bit of data ready on DOUT output (driver going from HZ state to output of first diagnostic bit) T_CLK_first First clock edge from falling edge on WR (1) T_setup Set-up time on DIN (1) T_hold Hold time on DIN T_DATA_next Time between rising edge on CLK and next bit ready on DOUT (capa (capacitor tied to the DOUT pin is 30pF max.) T_SPI_END Time between last CLK edge and WR rising edge T_risefall Rise and fall time of all applied signals (maximum loading capacitance is 30pF) T_WR Time between two rising edge on WR (repetition of the same command)
Note: (1) Guaranteed by design
Min.
Max. 500 2
Unit kHz s
3 20 20 100 1 5 300 20
s ns ns ns s ns s
Normal mode verification: * The command is the set of eight bits loaded via SPI, which drives the eight HS drivers on or off. * The command is activated with rising edge on WR pin.
Table 12: Digital Characteristics Symbol T_command_L_max. T_command_R T_PDB_recov
Note: (1) Guaranteed by design
(1) (1)
Description
Min.
Max.
Unit
Minimum time between two opposite commands for inductive loads and maximum HS driver current of 275mA Minimum time between two opposite commands for resistive loads and maximum HS driver current of 350mA The time between the rising edge on the PDB input and 90 percent of VB-1V on all HS driver outputs. (all drivers are activated, pure resistive load 35mA on all outputs)
1 2 1
s ms ms
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AMIS-39100: Octal High Side Driver with Protection
Data Sheet
PD 50%
t_PD_recov VOUTi
90% {VBi - 1V}
t
PC20070110.7
Figure 5: Timing for Power-down Recovery
DOUT
INPUT REGISTER
DIN
CMD8
OUTPUT REGISTER
CMD1
DIAG
CMD DRIVER
8
STATE DIAG
DIAG
DIAG
1
COMMAND
CMD8
REGISTER
CMD1
MEMORY
DIAG
MEMOCMD
8
MEMODIAG
DIAG
1
CMDx
High Side Driver
DIAGx
OUTx
Figure 6: SPI Block Diagram
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AMIS-39100: Octal High Side Driver with Protection
Data Sheet
Transfer data from diagnostic registers to the output registers Falling edge on W R
Transfer from input registers to the com m and registers (Rising edge on W R)
WR
CLK DIN
1
2
3
4
5
6
7
8
CM D CM D CMD CM D CMD CMD CMD CM D 5 6 7 3 4 1 2 8
O UT DIN : DRIVER COMM AND
DOUT
High Z
DIAG DIAG DIAGDIAG DIAG DIAG DIAG DIAG 5 6 7 2 3 4 8 1
High Z
IN
DO UT: O UTPU Ts THE STATE O F DIAG NO STICs
O UT1 to 8
Figure 7: Timing Diagram
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AMIS-39100: Octal High Side Driver with Protection
Data Sheet
9.0 Assembly and Delivery
Figure 8: Package Outline Drawing
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AMIS-39100: Octal High Side Driver with Protection
Data Sheet
10.0 Soldering
10.1 Introduction to Soldering Surface Mount Packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used.
10.2 Re-flow Soldering
Re-flow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stenciling or pressure-syringe dispensing before package placement. Several methods exist for re-flowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical re-flow peak temperatures range from 215 to 260C.
10.3 Wave Soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): o Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the print-circuit board; o Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is four seconds at 250C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
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AMIS-39100: Octal High Side Driver with Protection
Data Sheet
10.4 Manual Soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300C. When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270 and 320C.
Table 13: Soldering Process Package
Wave Soldering Method Re-flow
(1)
BGA, SQFP HLQFP, HSQFP, HSOP, HTSSOP, SMS (3) PLCC , SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO
Notes: 1. 2. 3. 4. 5.
Not suitable (2) Not suitable Suitable (3)(4) Not recommended (5) Not recommended
Suitable Suitable Suitable Suitable Suitable
All SMD packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the dry pack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a pitch (e) equal or smaller than 0.65mm. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5mm.
11.0 Revision History
Table 14: Revision History Revision Date 0.1 Various 0.2 June 2006 0.3 January 2007
Description Initial document Document formatted into new AMIS template Update of some values in Tables 1, 2, 3, 6 and 7. Update of explanation in paragraph 8.6: Diagnostics, and paragraph 8.7: SPI Interface. Update of Figure 8 Added section 10.0: Soldering
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AMIS-39100: Octal High Side Driver with Protection
Data Sheet
12.0 Company or Product Inquiries
For more information about AMI Semiconductor, our technologies and our products, visit our Web site at: http://www.amis.com
Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no warranty, express, statutory, implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMIS makes no warranty of merchantability or fitness for any purposes. AMIS reserves the right to discontinue production and change specifications and prices at any time and without notice. AMI Semiconductor's products are intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recommended without additional processing by AMIS for such applications. Copyright (c)2007 AMI Semiconductor, Inc.
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